..福島核災亂指揮 菅直人被訴
聯合新聞網 – 2012年8月3日 上午4:11.
....日本東京、福島和金澤三個地檢署1日宣布針對去年311福島核災事故展開立案調查，遭到起訴者包括前首相菅直人、東電前董事長勝俁恆久、原能會委員長班目春樹等33人，這是司法機關首次尋求讓當時的主事者為事故負起刑事責任。
時事新聞社報導，3個地檢署宣布就1300多位福島災民和市民團體提出的5件案件，展開刑事調查，其中3件在東京地方法院立案。
指控菅直人的起訴書中寫道，在福島第一核電廠一號核子反應爐發生洩漏後，菅直人和其他官員雖親自坐鎮指揮救災，但沒有採取必要的應變措施，導致氫氣爆炸，造成多人死傷，以及讓居民暴露於高濃度的輻射環境。檢方刻意等到國會7月23日公布福島核災屬於人禍後，才起訴菅直人等人，避免影響報告結果。
東京地檢署決定以「違反原子能等規制法罪」和「業務過失傷害罪」，對菅直人等人進行立案調查。日本國會核事故調查委員會和民間調查委員會均認定，菅直人在處理核事故中指揮不當。
2012年8月3日 星期五
2012年8月2日 星期四
Stress Relief (Dry Polishing)
Stress Relief (Dry Polishing)
http://www.disco.co.jp/eg/solution/library/strelief.html
In recent years, the demand for ultra-thin die for use in mobile phones, stacked packages, and a myriad of other applications has been increasing. But a decrease in die thickness has also resulted in decreased die strength and increased die warpage. Stress relief improves die strength for greater viability while reducing die warpage for greater usability in stacks and thin packages. The chart below outlines the four main types of stress relief, including dry polishing, a proprietary DISCO process.
Dry Polishing CMP (Chemical Mechanical Polishing) Wet Etching Dry Etching
Figure 1: Major stress relief processes
Application
Dry polishing effectively removes the damage layer that inevitably remains after fine grinding. The result is a mirror finish on the wafer backside, increased die strength, and reduced die warpage.
The following graph shows die strength (as measured with the ball press test) at increasing amounts of material removal. DISCO research has demonstrated that 2 micrometers of removal provides optimum stress relief results.
Figure 2: Variation in die strength with DP removal depth
Machines
DISCO's polishers handle a wide variety of applications and are in-line configurable with DISCO grinders for greater wafer handling safety. In addition, DGP8760 offers grinding and polishing in one complete unit.
DFP8140 DFP8160 DGP8760
Dry Polishing Wheel
DISCO's specially-developed wheel for stress relief has the following features:
• Contains a non-diamond grit.
• Provides a mirror finish without saw marks.
• Uses no chemicals, slurry or water for reduced environmental impact.
• Improves cost of ownership through reduced water costs, etc.
Dry Polishing wheel
Kiru, Kezuru, Migaku Topics
Blade Dicing
Laser Dicing
Grinding
Stress Relief
Stress Relief (Dry Polishing)
DBG & Dry Etcher Process Flow
DBG
Others
Applications Example
Dicing
Grinding
Polishing
DBG
Solutions Support
Applications Support
Dicing and Grinding Service
http://www.disco.co.jp/eg/solution/library/strelief.html
In recent years, the demand for ultra-thin die for use in mobile phones, stacked packages, and a myriad of other applications has been increasing. But a decrease in die thickness has also resulted in decreased die strength and increased die warpage. Stress relief improves die strength for greater viability while reducing die warpage for greater usability in stacks and thin packages. The chart below outlines the four main types of stress relief, including dry polishing, a proprietary DISCO process.
Dry Polishing CMP (Chemical Mechanical Polishing) Wet Etching Dry Etching
Figure 1: Major stress relief processes
Application
Dry polishing effectively removes the damage layer that inevitably remains after fine grinding. The result is a mirror finish on the wafer backside, increased die strength, and reduced die warpage.
The following graph shows die strength (as measured with the ball press test) at increasing amounts of material removal. DISCO research has demonstrated that 2 micrometers of removal provides optimum stress relief results.
Figure 2: Variation in die strength with DP removal depth
Machines
DISCO's polishers handle a wide variety of applications and are in-line configurable with DISCO grinders for greater wafer handling safety. In addition, DGP8760 offers grinding and polishing in one complete unit.
DFP8140 DFP8160 DGP8760
Dry Polishing Wheel
DISCO's specially-developed wheel for stress relief has the following features:
• Contains a non-diamond grit.
• Provides a mirror finish without saw marks.
• Uses no chemicals, slurry or water for reduced environmental impact.
• Improves cost of ownership through reduced water costs, etc.
Dry Polishing wheel
Kiru, Kezuru, Migaku Topics
Blade Dicing
Laser Dicing
Grinding
Stress Relief
Stress Relief (Dry Polishing)
DBG & Dry Etcher Process Flow
DBG
Others
Applications Example
Dicing
Grinding
Polishing
DBG
Solutions Support
Applications Support
Dicing and Grinding Service
Definition of dambar
on leadframes, a feature for plastic molded packages that blocks (dams) the flow of the plastic compound to the external lead areas of the leadframe during the molding cycle. Dambars electrically short the leads together and must be removed (trimmed) before electrical testing of the device can be performed. [SEMATECH]
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